Wi-Fi SiP Module is suited for small mobile phones

Wi-Fi SiP Module is suited for small mobile phones

Measuring 9.6 x 9.6 x 1.6 mm, 802.11 b/g Wi-Fi System in Package (SiP) module provides data-sharing solution for VoIP and dual-mode mobile telephony applications. Tailor-made for mobile phone systems and user interface, product eliminates duplicated functions between system and Wi-Fi module to allow for miniaturization of design. No special manufacturing process is required to achieve miniaturization.


To eye on small-sized and low-cost mobile phone market

Universal Scientific Industrial Co., Ltd. (USI), a leading global company in the Design, Manufacturing and Services (DMS) industry, announced today the introduction of the next-generation 802.11 b/g Wi-Fi System in Package (SiP) module designed for mobile phone. The cutting-edge Wi-Fi SiP module, with a miniature size of 9.6 x 9.6 x 1.6 mm, fully demonstrating USI’s leading position in integration and miniaturization of wireless communication products. USI has commenced joint design and development efforts with global mobile phone providers and makers of entertainment electronics. The module has entered sample testing and is expected to start mass production by the end of year 2005.

“The Wi-Fi SiP module, with a size of 9.6 x 9.6 x 1.6 mm, is designed for mobile telephony applications, including VoIP and dual-mode applications, offering a more diverse data-sharing solution for mobile phones. Compared with traditional modules, this light and thin Wi-Fi SiP module is tailor-made for mobile phone systems and user interface, eliminating duplicated functions between the system and Wi-Fi module, which results in miniaturization of the size and, also importantly, lowering the cost. Besides the miniaturization in length and width, the Wi-Fi SiP module’s slim design is more attuned to current light-and-thin design trend of mobile phones,” said Gilbert Wei, Corporate Vice President and General Manager of Value-Added Solution Business Group of USI.

A special characteristic of the development of this 9.6 x 9.6 x 1.6 mm Wi-Fi SiP module is that no special manufacturing process is required. Instead of employing a technology as LTCC usually deemed necessary for small-size module, USI has managed to overcome various technical difficulties to be able to use only ordinary manufacturing processes to achieve the miniaturization and more importantly to lower the cost without sacrificing the standard of high performance. Key to topple the greatest challenge in this module’s development is USI’s strong combined capabilities in circuit design and the manufacturing capabilities of miniaturization, for which USI has filed patent applications.

USI, equipped with outstanding design and manufacturing capabilities, will continue to leverage its seasoned experience in modules to develop smaller-sized Wi-Fi SiP and Bluetooth modules. In addition to traditional IT applications, USI will extend its business to wireless radio applications such as UWB and WiMax for multimedia and home networking applications that are experiencing solid growth. Maximizing its product synergy, USI is poised to maintain its leading position in the miniaturized mobile communication technology field.

About USI

Universal Scientific Industrial Co., Ltd. (USI), established in 1976, is a leading global company in the DMS industry. With its Design-to-Distribution total solutions and module-to-systems product offerings, USI is recognized as the strategic DMS partner for Global Brands in 4C (Computing, Communications, Consumer Electronics and Car Electronics) industries. Integrating its core technologies of Computing, Wireless Communication and Video/Audio Processing, USI offers high quality, value-added and cost-competitive products covering 4C application fields. For more information, please visit www.usi.com.tw.

COPYRIGHT 2005 ThomasNet, Incorporated

COPYRIGHT 2005 Gale Group