Wide and narrow bandgap semiconductors for power electronics: A new valuation
Hudgins, Jerry L
An advantage for some wide bandgap ma…
Category: Journal of Electronic Materials
Designing Nanostructures for Sensor Applications
Zhao, Y-P
Nanostructured materials have shown great potential in improving the sens…
Optimization of black oxide coating thickness as an adhesion promoter of copper substrate in plastic integrated-circuit packages
Lebbai, M…
Mechanical Integrity Evaluation of Low-k Device with Bump Shear
Su, Peng
The mechanical integrity of low-k dielectric films has brou…
TCAD simulation of ion implantation test for controlling quality of GaAs substrates used for fabricating implanted devices
Blakey, Peter A…
Fiber-Alignment Shifts in Butterfly Laser Packaging by Laser-Welding Technique: Measurement and Finite-Element Method Analysis
Hsu, Y C</p…
Wettability of electroless Ni in the under bump metallurgy with lead free solder
Young, Bi-Lian
This study investigates the wettabil…
Measurement of minority carrier lifetime in n-type MBE HgCdTe and its dependence on annealing
Edwall, D D
Results are presented for …
Deposition of diamond from alcohol precursors in an electron cyclotron resonance plasma system
Gilbert, Donald R
Microstructural con…
Li Diffusion in Epitaxial (112¯0) ZnO Thin Films
Wu, P
Zinc oxide (ZnO) possesses many interesting properties, such as a wide energ…