Applied Materials Launches New Dedicated 300mm RTP System for High-Volume Chipmaking

Applied Materials Launches New Dedicated 300mm RTP System for High-Volume Chipmaking

Business/Photo Editors

Semicon Taiwan 2002

NOTE TO MEDIA: Multimedia assets available

SANTA CLARA, Calif.–(BUSINESS WIRE)–Sept. 16, 2002

Radiance(TM) Vantage(TM) System Features Streamlined Platform Design

to Achieve World Class Equipment Efficiency and RTP Performance

Applied Materials, Inc. introduces its new Radiance(TM) Vantage(TM) system, a dedicated, two-chamber rapid thermal processing (RTP) solution for 300mm high-volume chip manufacturing. The Vantage system combines Applied Materials’ world-class Radiance 300mm RTP technology with a streamlined platform design to deliver industry-leading productivity and cost of ownership for all anneal applications.

“The Radiance Vantage system extends Applied Materials’ leadership in RTP technology and sets a new benchmark in thermal processing productivity,” said Dr. Randhir Thakur, general manager of Applied Materials’ Transistor Systems Group. “Our Radiance chamber is the global standard for 300mm RTP applications, with over 100 chambers installed in chipmaker fabs around the world.

“The new Radiance Vantage platform enables the use of our advanced RTP technology for mainstream applications that depend on productivity, cost of ownership and reliability to ensure manufacturing profitability. The simplified design of this system also allows it to be shipped as a single unit, enabling significantly faster start-up time and reduced time to production. We have already received orders for the Radiance Vantage from customers in Japan, Korea and the U.S.”

The Radiance Vantage supports all annealing applications, including implant annealing, spike annealing and salicidation, as well as dry rapid thermal oxidation. The system is configured with up to two RTP process chambers that are linked directly to a factory interface and track robot. Mechanical throughput of the system exceeds 100 wafers per hour due to its simplified wafer transfer sequencing. Chipmakers can quickly install and qualify the Radiance Vantage tool since no additional system assembly is required for installation. The Vantage platform also is designed for ease of maintenance and high reliability in volume production.

Applied Materials’ line of RTP products also includes the Radiance Centura(R) system, an advanced technology solution that provides customers with exceptional processing flexibility. While the Radiance Vantage is a dedicated system for high-volume atmospheric RTP applications, the Radiance Centura system allows the integration of multiple technologies, such as low pressure CVD (chemical vapor deposition) and DPN (decoupled plasma nitridation) chambers, for advanced logic gate or flash gate stack formation. The reduced-pressure capability of the Radiance Centura system also enables the company’s patented in-situ steam generation process (ISSG).

According to VLSI, a market research firm, the market for RTP technology totaled $348 million in 2001 and is projected to grow to $843 million by 2004. Approximately 65% of the 2004 estimate is for 300mm RTP equipment. Applied Materials has been the leading supplier of RTP systems to the semiconductor industry since 1996.

The Radiance Vantage system will be exhibited at Semicon Taiwan from September 16-18 in Taipei, Taiwan, at Applied Materials booth #1138.

Applied Materials, the largest supplier of products and services to the global semiconductor industry, is one of the world’s leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials’ web site is www.appliedmaterials.com.

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